Senior Laser Process Engineer in Singapore at Lumileds

Date Posted: 5/21/2020

Job Snapshot

  • Employee Type:
  • Location:
  • Job Type:
  • Experience:
    Not Specified
  • Date Posted:

Job Description


  • Process owner for die singulation process using laser technology.
  • Attend process related issues in production line, including yield loss, quality concern and process induced defects
  • Development, process/product characterization and qualification of Laser Scribing / Laser Dicing processes for pilot runs and volume ramp within the Singapore Operations.
  • Establishing good process margins and inline controls of these new processes. Creating and updating of process specification and documentation of working procedure.
  • Resolving reliability or yield issues related to the Wafer Backend processes and lead trouble-shooting of defect and yield issues and process excursions associated with the new process/tools.
  • Championing engineering experiments for process characterization.
  • Establish Out-of-control Action Plans, specifications for procedures to be followed.
  • Provide training to engineering technicians and production personnel.
  • Any other duties assigned by the manager.


  • Bachelor or Post-graduate degree in Electrical Electronics Engineering /Mechanical Engineering or Materials Engineering is required with more than 3 years of work experience in the Laser Dicing/Scribing process. Experience with ASM ALSI 1204/1205 or DISCO DFL7341/ 7160 would be advantageous.
  • Strong knowledge of semiconductor process with strong team-building and technical expertise to develop collaborative solutions.
  • Strong knowledge of SPC and quality tools such as FMEA and Control Plan.
  • Self-driven leader and strong team player with keen technical ability, systematic approach, detailed-oriented, excellent problem-solving skills, and positive attitude
  • Good interpersonal and analytical skills.
  • Ability to work independently, be hands-on and expected to dive into technical details as required.